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Investing.com -- SCHMID Group (NASDAQ:SHMD) shares jumped 23% Wednesday after the company delivered its first specialized null Line H+ system for Panel-Level Packaging applications to a leading U.S. technology company.
The null Line H+ platform processes formats up to 700×700mm and is designed for next-generation substrate manufacturing. The system features a single-sided, touchless process architecture aimed at ensuring cleanliness and process stability for advanced packaging applications.
The platform includes an integrated inline flipping station that enables both face-up and face-down processing while maintaining leading-edge orientation throughout the process flow. The system’s architecture is engineered to minimize media carry-over and features particle-free drive solutions in dryer modules.
The delivery strengthens SCHMID’s position in applications including AI-driven computing infrastructure, high-performance computing platforms, and space and defense electronics. The system is designed to address increasing panel sizes required by the growing panel-level packaging market.
Roland Rettenmeier, Chief Sales Officer of SCHMID Group, said: "The global expansion of AI infrastructure, high-performance computing platforms, and rapidly growing demand in space and defense applications is fundamentally transforming the semiconductor and advanced packaging industry. Increasing interconnect density, advanced power-delivery architectures, and the economic scaling of chiplet-based designs are accelerating the transition from traditional wafer-level packaging toward large-format panel-level technologies."
The null Line H+ platform is based on an expanded modular architecture that incorporates horizontal processing of large-format substrates. The system features full enclosure design for operation in controlled manufacturing environments and includes automated real-time process parameter monitoring with closed-loop control.
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